A Royal Academy of Engineering UK-China Industry Academic Partnership funded collaborative research & development project has now come to a successful conclusion. The project utilises UWS Institute of Thin Films, Sensors & Imaging (ITFSI – www.itfsi.com )) high density plasma assisted electron beam thin film deposition technology, The technology offers enhanced throughput and retrofitability to existing & new thin film deposition systems. Project partners are University of the West of Scotland, Tong Ji University (Shanghai), Helia Photonics Ltd (Livingston, Scotland) and Jason Vacuum Company (JAVAC) Shanghai.
As part of the project ITFSI plasma source technology was deployed into a JAVAC built thin film deposition system and successfully demonstrated. Photo shows left to right Dr Huang ( JAVAC technical director), Professor Des Gibson (UWS ITFSI director) and Mr Chen (PhD student from Tong Ji university) - the team who carried out the onsite trialling at JAVAC (Shanghai). A technical paper covering the project work is in preparation. The overall project will form the basis of a UWS ITFSI Research Excellence Framework case study.
Professor Gibson`s China trip also covered a GCRF pre Newton fund project with Fudan University (Shanghai), progressing a novel low cost breath analysis sensor for early diagnosis and management of chronic respiratory conditions. Dr Shigeng Song (ITFSI) was also in China progressing another potential GCRF project with Shanghai University involving low cost thin film heterojunctions for photovoltaic next generation power generation.
ITFSI has a wide range of InnovateUK, STFC, Royal Academy of Engineering, Scottish Enterprise and Horizon 2020 funded projects. ITFSI has instigated a masters programme in Advanced Thin Film Technologies – now entering its third year with primarily a Chinese cohort. ITFSI is commercialising thin film and sensor based research through two new company spin-outs: Novosound & Albasense. ITFSI is currently planning launch of Continuous Professional Development courses in thin film technologies.